Influences of silicon carbide nanowires’ addition on IMC growth behavior of pure Sn solder during solid–liquid diffusion

In this paper, various mass fractions (0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) of silicon carbide nanowires (SiC NWs) were incorporated into pure Sn solder to enhance the performances joint. The wetting behavior, shear strength, and intermetallic compound (IMC) growth mechanism Sn–xSiC/Cu during solid–liquid diffusion at 250 °C investigated systematically. experimental results demonstrated that wettability had a significant improvement when addition SiC NWs was up 0.6 wt%, excessive additives would degrade composite solder. formation Cu6Sn5 IMC layer observed Sn–xSiC solder/Cu interface. Meanwhile, as conducive restraining interfacial soldering process thickness overtly fell down after doping 0.8 wt% Moreover, NW contribute enhancing mechanical performance fracture joint changed from mix brittle ductile characteristic typical fracture.